2. Wafer Batter MixerCompletely made from stainless steel, thisbatter agitator is very durable, and it can be cleaned with water in a short time. The blades, with dynamic and static seals, could convert 25kg flour into 65kg batter only in 3 minutes, and it is very easy to clean these blades.
    2. Wafer Baking OvenOur wafer baking system makes use of LPG or LNG to heat baking plates, and this process is controlled by a Mitsubishi PLC in which there is a PID controller used to regulate heating temperature automatically.
    2. Wafer Sheet Receiving MachineThis biscuit sheet receiver takes advantage of sensors to check if wafer sheets are in good shape, and if not, corresponding wafer sheets will be collected and then smashed by the wafer chip smashing machine for further use.
    2. Wafer Sheet Cooling MachineOwing to the enhanced natural cooling effect, this wafer cooling device effectively alleviates heat stress that is generated during baking process, otherwise wafer sheets will crack even when a small impact force is applied.
    2. Wafer Sheet Picking MachineFor example, when cream spreading machine, wafer cooling machine or any other machine of the wafer production line fails to work temporarily, this wafer sheet picker receives relevant signals sent by the PLC
    2. Wafer Cream Spreading MachineFor this cream coating machine, both wafer number and cream amount could be adjusted according to practical needs, while the thickness of each cream layer is also adjustable.
    2. Wafer Cooling MachineThe cooling chamber has a relative humidity of 55%, and its temperature could be adjusted within 13-15℃.
    2. Wafer Belt ConveyorChain drive is adopted for mechanical power transmission, and it is outfitted with tensioning devices. All the tensioning wheels are driven by bearings.
    2. Wafer Cutting MachineThe number of laminated layer is controlled according to practical condition, and the tool rest could be changed so as to get desired wafer size.
    2. Wafer Cream MixerOur product makes use of a 4.5kW motor to drive two sets of mixing paddles to rotate in the opposite directions, and the tipping system, which is utilized to discharge cream from this cream mixing machine
    2. Wafer Chip Smashing Machine for RecyclingThis wafer production equipment is constructed from stainless steel so as to deliver safe and hygienic performance, and it is powered by a 3kW SEW/ABB motor to realize high power and high efficiency.
    2. Cream Storage BucketThis food container is constructed from 304 stainless steel, and it is outfitted with SEW gear motor and superior electrical components.

Automatic Flat Wafer Production Line

As a well-known food machinery manufacturer in China, we could provide customers with nine types of automatic flat wafer production line. These wafer lines have various production capacities as a result of their different mould numbers, and the mould number includes 27, 33, 39, 45, 51, 63, 65, 69 and 75.

Detailed Information

Detailed Information
1. The baking oven has 27-75 moulds, and the mould base is made from ductile iron, while the baking plates are constructed from heat-resisting cast iron. For baking plate, its standard size is 470×325mm, and it can be made to as large as 500×350mm. In addition, the power transmission mechanism and road wheels are patented in China, and the PID temperature controller is intended to adjust baking temperature to realize uniform wafer color.

2. For this wafer production line, its wafer batter mixer is completely manufactured from stainless steel, and it could process 50kg flour into batter just in 3 minutes. This device could be cleaned easily and rapidly with the help of water, and its blades adopt dynamic and static seals. Moreover, the electrical system has a protection level of IP55.

3. The batter storage tank is made from stainless steel, and it has a sandwich structure to cool batter by using cold water. This tank has a capacity of 0.5m3, and a stainless steel pneumatic diaphragm pump is utilized to transport batter.

4. The wafer sheet cooling machine is fabricated from stainless steel, and it is driven by an independent motor. Based on the shape, it is further divided into vertical type and archway type.

5. When it comes to wafer cream spreading machine, our flat wafer production line offers different choices.
a. Contact spreading machine: The machine frame is constructed from galvanized steel, and stainless steel plates are covered on the surface for better decoration effect. The spreading head has a composite structure to facilitate assembly and disassembly process, thus it is easy to clean. On the other hand, the laminating device reciprocates as driven by cylinders, and wafer sheets are held by single roller.

b. Film spreading machine: Cream or chocolate on the spreading roller is stripped off by a stripping knife so that cream films are continuously laid onto wafer sheets, just like curtains. In this way, cream is spread on wafer sheets rapidly and reliably, and cream films are of the same thickness regardless of wafer thickness variations. Moreover, the laminating device adopts rotary plug-in structure, and laminating step is not limited by cream thickness or wafer sheet number. The laminating roller is made from stainless steel for the purpose of easy cleaning, and wafer sheets are held by double rollers.

6. Our flat wafer production line uses a cooling cabinet to cool wafer biscuits. This freezer is constructed from stainless steel, while parts that will come into contact with wafer book are fabricated from SUS304. With cooling fan placed outside the freezer, the cabinet has a relative humidity of 55%.

7. When it comes to wafer cutting machine, it is classified into two models. The first model uses steel wire to cut wafer books, and the standard cutting speed is 8 books per minute. The second model uses blade, and its standard cutting speed is 10 books per minute though 17 books/min is also achievable by adopting special design.

8. The wafer cream mixer contains two types which are horizontal type and vertical type. The horizontal type requires manual cream transportation, while the vertical type makes use of a screw pump to deliver cream automatically.

Performance Requirement
The automatic flat wafer production line is actually a biscuit production system that is composed of different machines, but it must offer satisfying performance as regulated below.

1. After processed by wafer sheet picking machine, at least 98 percent of wafer sheets shall be in good condition, indicating that they should have clear pattern, uniform thickness, homogeneous color and plump shape.

2. When wafer sheets are on the wafer belt conveyor, 95 percent of them shall be in good shape, and the coating weight variation should be within ±3%.

3. This leisure food processing equipment shall offer a certain amount of wafer biscuits in a fixed time period. When producing 50g wafer book that is composed of 5 wafer sheets and 4 cream coatings, the production capacities of every wafer production line should be in accordance with the following table.
Production Capacity

Wafer : Cream 27-mould 33-mould 39-mould 45-mould 51-mould 65-mould 69-mould 75-mould
1.25 : 1 1.96T/24h 2.46T/24h 3.02T/24h 3.46T/24h 4.15T/24h 5.26T/24h 5.51T/24h 6.0T/24h
1.35 : 1 2.05T/24h 2.68T/24h 3.15T/24h 3.62T/24h 4.34T/24h 5.5T/24h 5.8T/24h 6.3T/24h
1.5 : 1 2.18T/24h 2.85T/24h 3.35T/24h 3.85T/24h 4.62T/24h 5.8T/24h 6.2T/24h 6.7T/24h

4. The 304N stainless steel applied should have a thickness of 1.2mm.

5. For baking oven, cream spreading machine, freezer and cutting machine, there are sound-light alarming devices.

Technical Data of Automatic Flat Wafer Production Line
Mould No. 27 33 39 45 51 65 69 75
Length of baking oven (mm) 6000 7150 8300 9450 10600 13200 14000 15140
Total length of production line (mm) 22000 23150 24300 25450 26600 29300 30000 37000
Total weight of production line (t) 13 14.5 16 18 20 28 31 32
Baking oven power (kW) 5.52 5.52 5.52 5.52 5.52 7.52 7.52 8.12
LNG consumption (m3/h) 25 28 30 35 40 48 50 54
Compressed air consumption (m3/h) 0.9 0.9 1.5 1.5 1.5 2 2 2.5
Production capacity in book/min 14 17 20 23 26 33 35 38
Production capacity in kg/h 908 119 140 160 193 229 258 263

Note:
1. Standard bake plate size: 470×325mm
2. Pattern size: 2.5×2.5×0.5mm
3. Wafer size: 464×321mm
4. True cutting size: 456×315mm
5. Wafer thickness range: 2.5-3.2mm
6. Standard wafer weight: 50-60g
7. Baking time: 2 minutes
8. Heating method: By LNG/LPG, or electricity (380V/50Hz/3Ph)

Finished Wafer Sample

Feature and Application

Feature and Application
This wafer biscuit production line exhibits many remarkable characteristics, such as compact structure, stable performance, convenient maintenance, small floor area, high production capacity, low power consumption as well as no environmental pollution, and it can be operated by a few workers.

Owing to these features, our flat wafer production line is exceptionally suitable to make different types of wafers in an automatic way, and by using other moulds and wafer recipes, it would fabricate wafers with different shapes and tastes. Moreover, the patterns of baking plate could be customized.

System Composition

System Composition
The flat wafer production line primarily consists of wafer batter mixer, wafer baking oven, wafer sheet receiving machine, wafer sheet cooling machine, wafer sheet picking machine, wafer cream spreading machine, wafer cooling machine, wafer belt conveyor, wafer cutting machine, wafer cream mixer and wafer chip smashing machine. However, there are some optional devices, including dual-head wafer cream spreading machine, automatic weigh feeder and wafer control system, hard chrome plating on surface of baking plates.

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