Wafer Cooling Machine, Wafer Cooling Cabinet

The wafer cooling machine serves to cool cream-filled wafer books when wafer books travel through it on the conveyor belt, thereby making these wafer books solid enough for cutting and packing operations.

Feature
1. Our cooling tower is completely constructed from stainless steel, and all the components that will come into contact with wafer books are made from 304 stainless steel. In addition, the cooling fan is set outside this wafer cooling device.

2. The cooling chamber has a relative humidity of 55%, and its temperature could be adjusted within 13-15°C.

3. For this wafer cooling machine, its processing capacity is related to equipment performance as well as required cooling time. Usually, cooling time is set between 15 and 25 minutes according to biscuit type.

4. The main conveyor chain moves step-by-step (stepping), and there is one conveyor motor at the inlet and outlet of our wafer cooling cabinet, respectively. These two motors are used to control conveyor movement at the inlet and outlet, thus perfectly transporting wafer books without damaging them.

5. The observation window allows users to real-time monitor wafer status, and this vertical cooling machine would transport wafer biscuits to the next step after cooling operation is finished.

Available Model
1. 3-Layer Wafer Cooling Machine
a. Size: 3130×1200×2700mm
b. Total power (without cooling fan): 1.11kW (0.75kW for main motor, 0.18kW for inlet motor, 0.18kW for outlet motor)
c. Processing capacity: 65 wafer books

2. 4-Layer Wafer Cooling Machine
a. Size: 3130×1200×3600mm
b. Total power (without cooling fan): 1.11kW (0.75kW for main motor, 0.18kW for inlet motor, 0.18kW for outlet motor)
c. Processing capacity: 112 wafer books

3. 5-Layer Wafer Cooling Machine
a. Size: 3130×1200×4500mm
b. Total power (without cooling fan): 1.11kW (0.75kW for main motor, 0.18kW for inlet motor, 0.18kW for outlet motor)
c. Processing capacity: 160 wafer books

Note:
1. Baking plate size: 470×325mm, 500×350mm
2. Inlet air temperature: 5°C
3. Wafer temperature at inlet: 6-10°C
4. Outlet air temperature: 17-20°C
5. Thermal insulation material: Rigid PU foam sandwiched between high-grade steel panels
6. Belt pulley: Aluminum alloy
7. Chamber humidity: ≤55%