Our wafer sheet cooling machine, as the name implies, is a wafer biscuit cooler intended to cool wafer sheets gradually while gently delivering them. Owing to the enhanced natural cooling effect, this wafer cooling device effectively alleviates heat stress that is generated during baking process, otherwise wafer sheets will crack even when a small impact force is applied. In this regard, this wafer cooling equipment is also known as a stress relieving machine.
Available Model
Based on machine structure, the wafer sheet cooling machine is divided into two models which are LP4 archway type wafer cooler and LP3 vertical wafer cooler. LP4 is a high-end cooler, and it even allows people to walk under it, while LP3 is a standard cooler.
LP4 Archway Type Wafer Sheet Cooling Machine
1. Size: 2280×720×2730mm
2. Power: 0.37kW
3. Delivery capacity: 60 pieces
4. Raw material: Stainless steel for machine frame, 304 stainless steel for components that will come into contact with wafer during working, food grade PU belt
5. Main feature: This cooler is driven by an independent motor. There is a PLC used to control photoelectric detection, and automatic stepping will be conducted if timeout occurs.
LP3 Vertical Wafer Sheet Cooling Machine
1. Size: 1000×700×2300mm
2. Power: 0.18kW
3. Delivery capacity: 42 pieces
4. Raw material: Stainless steel for machine frame, 304 stainless steel for components that will come into contact with wafer during working, food grade PU belt
5. Main feature: This cooler is driven by an independent motor. There is a PLC used to control photoelectric detection, and automatic stepping will be conducted if timeout occurs.
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