Wafer Cutting Machine

As indicated by its name, our wafer cutting machine is utilized to cut laminated wafer books into different sizes, and this is realized in a mechanical way, not pneumatically. The number of laminated layer is controlled according to practical condition, and the tool rest could be changed so as to get desired wafer size. In addition, this mechanical cutting equipment would switch between longitudinal cutting and transverse cutting automatically.

Working Principle
For this food processing machine, its chains are driven by a motor to carry out reciprocating motion, which causes pushing disc to conduct rectilinear motion longitudinally and transversely. In this way, wafer books are pushed by the pushing disc to get cut in both directions.

Raw Material
The frame and guide rail of our wafer cutting machine are manufactured from A3 carbon structural steel followed by preservative treatment, and all the components that will come into contact with wafer sheets are made from 304 stainless steel. Moreover, this wafer biscuit cutting equipment is outfitted with two different cutters, and its fully enclosed safety shield could be opened or closed rapidly.

Technical Data of Wafer Cutting Machine
1. Size: 2000×1700×880mm
2. Power: 0.75kW
3. Weight: Approx. 400kg
4. Baking plate size: 470×325mm
5. Cutting method: Mechanical cutting (0.3mm blade gives a clean and tidy cut without damaging knife edge)
6. Minimum cutting speed: 10 wafer books per minute
7. Cutting size: Set by user