2. Humidifying MachineThis wafer biscuit processing machine takes advantage of SH series constant-temperature and constant-humidity control system to provide different temperature and humidity combinations, so as to deal with various kinds of wafer biscuits.
    2. Wafer Arranging MachineThis leisure food processing equipment makes use of stainless steel to fabricate its frame, and the conveyor belt is of food grade to ensure hygienic performance.
    2. Inclined ConveyorThis biscuit conveying equipment delivers wafer sheets steadily without generating relative motion between the conveyor and wafer sheets, thus avoiding damage to wafer sheets.
    2. Horizontal ConveyorOur stainless steel conveyor allows various adjustments during normal working. This function effectively reduces wafer loss, and it also helps to enhance production efficiency of the entire wafer line.
    2. Special Wafer Cream SpreaderThe special wafer cream spreader, also known as a non-contact cream spreader, is especially designed for hollow wafer biscuits, and it could deal with both cream and chocolate.
    2. Wafer Laminating MachineAfter wafer sheets are filled with cream or chocolate in a row, they will enter into the wafer laminating machine to get stacked.
    2. Wafer Trimming MachineIn general, this hollow wafer production equipment is designed to remove filled cream or chocolate when these materials are on the side surfaces of wafer books, thus offering a tidy and aligned appearance.
    2. Wafer Flat Pressing MachineWhen the optoelectronic switch detects that there is a wafer book, the conveyor belt will stop moving after some time, not instantly.
    2. Refrigeration SystemThis cold cabinet uses R-22 as the refrigerant, and its actual performance depends on several factors, such as production capacity, type and weight of filled layer, weather condition of installation site, etc.
    2. Wafer SeparatorThe first function of this wafer biscuit separation device is to separate water biscuits that are cut by wafer cutting machine into several lanes for transportation, and these wafer biscuits are spaced with a certain distance between them.

Hollow Wafer Production Line

The hollow wafer production line is primarily utilized to make laminated wafer biscuits that are similar to half-cylinder in shape, and its maximum production capacity could reach up to 53400 wafer bars per hour. This wafer biscuit production equipment has two baking ovens, one is for the production of special-shaped (half-cylinder) wafer sheet, and the other is for flat wafer sheet.

Our food processing machinery is suitable for many enterprises and individuals, such as large manufacturing plants of cream products or wafer biscuits, individuals that have large production workshops and financial strength, food industry experts that has built up complete sales network, etc.

Background
The hollow wafer production line was developed in 2007, and it was manufactured on the basis of our patented techniques to realize novel design as well as high degree of automation. After continuous field test and technical innovation since its release to the market in 2008, now this leisure food production plant is a quite mature product that deserves your trust.

Detailed Information

Technical Advantage
Our hollow wafer production line is a perfect integration of many leading-edge techniques, so it will surely deliver satisfying performance as expected.

1. Baking Plate
The baking plates are uniform, exquisite and long lasting owing to the implementation of unique casting and carving techniques for special-shaped baking plates.

2. Temperature Control
A PID controller is used to auto-control the baking temperature, and the temperature fluctuation is within ±3°C.

3. Field Bus
The PROFIBUS DP control technology simplifies wafer biscuit production machines, and convenient maintenance is achieved accordingly.

4. Third Spreading Roller
Our hollow wafer production line has an especially designed third spreading roller to deal with thick layer of chocolate (or cream). This roller spreads chocolate on the surface of wafer sheets evenly, and chocolate won’t leak at the spreading head.

5. Wafer Trimming
For wafer books that are filled with cream or chocolate, they are not tidy enough because they often have cream residual on the side surface. Given this, our wafer trimming machine is developed to remove these residuals and provide clean wafer books.

6. Flat Pressing
Our wafer flat pressing machine is intended to press wafer sheets and cream layers together to form wafer books without damaging them, and it shows a high yield rate.

7. Moisture Conditioning
Moisture conditioning actually refers to two steps: the first step is to humidify wafer sheets, and the second step is to dry wafer books by cooling. These treatments are conducted for one purpose, i.e. to connect wafer sheet and chocolate (cream) firmly.

8. Wafer Cutting
The compression bar moves up and down automatically so as to cut wafer books into desired size with a clean and tidy look.

Technical Data of Hollow Wafer Production Line
1. 33-mould gas heated baking oven for hollow wafer
a. Length: 7100mm
b. Natural gas consumption: 25m3/h
c. Power: 5.52kW
d. Production capacity: 9 pieces per minute (80g/pcs)
2. 27-mould gas heated baking oven for flat wafer
a. Length: 6700mm
b. Natural gas consumption: 20m3/h
c. Power: 5.52kW
d. Production capacity: 10 pieces per minute (55g/pcs)
3. Standard baking plate size: 470×325mm
4. Compressed air consumption: 0.5m3/min
5. Baking time: 3 minutes
6. Total length of hollow wafer production line: 29,000mm
7. Total rated power: 46kW
8. Min. operator number: 5
9. Floor area: All the machines take up an area of 230m2 in total, but the workshop shall be 600m2 at least.

Performance Requirement
1. At the outlet of wafer sheet picking machine, at least 98 percent of wafer sheets should have clear pattern, uniform thickness, homogeneous color and plump shape.

2. When wafer sheets are on the wafer belt conveyor, 95 percent of them shall be in good shape, and the coating weight variation should be within ±3%.

3. Our hollow wafer production line has a large production capacity. Technical speaking, it outputs 8 pieces per minute, and each piece contains 224 semi-cylinder biscuits (14×16). If 4 out of 16 is cut every time, it means 448 semi-cylinder biscuits are produced every minute (14×16/4×8=448), namely 26700 biscuits per minute. On the other hand, if 2 out of 16 is cut every time, it means 896 semi-cylinder biscuits are produced every minute (14×16/2×8=896), namely 53400 biscuits per minute.

On the other hand, when cutting wafer biscuits, the ambient temperature should be within 17-20°C, and the relative humidity should not exceed 60%. For the filled layer (chocolate or cream), it is more likely to get solidified at the temperature range of 10-12°C, and it won’t shrink after cooling for 25-30 minutes.

4. The 304N stainless steel plate used for every machine of this wafer line is 1.5mm thick, except for the cooling chamber. For the cooling chamber, it is made from 1.2-mm-thick stainless steel.

5. There should be sound-light alarming devices for the baking oven, cream spreading machine, freezer and the cutting machine.

Packing
Every single machine of this hollow wafer production line is packed by flat rack, and it is covered with a layer of moisture-proof film. Then, these machines are placed in two 40'HQ containers and one 40'GP container.

Samples

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