The wafer baking oven is an indispensable and actually the most important food processing machine for a wafer production line, and it is intended to automatically dispatch batter onto baking plates and then bake these ingredients to produce uniform and qualified wafer sheets. Our wafer baking system makes use of LPG or LNG to heat baking plates, and this process is controlled by a Mitsubishi PLC in which there is a PID controller used to regulate heating temperature automatically.
Feature
1. The mould base is constructed from QT500 ductile iron, thus imparting some excellent properties to this bake-out furnace, such as little deformation, high tensile strength and long service life.
2. Our wafer baking oven uses heat-resisting cast iron to fabricate baking plates. This material is characterized by high density and little deformation, while hard chrome could be coated on its surface.
3. The quincunx burner nozzles are designed to provide stable flames, and the combustion efficiency is quite high.
4. Some thermal insulation boards are placed inside the baking stove to prevent thermal radiation, while thermally insulated doors are also applied. As a result, good heat preservation effect is obtained.
5. Inside our baking oven, the furnace rail is able to cool major mechanical moving parts, thereby prolonging the lifespan of the entire system.
6. The front driving mechanism enables this gas heated oven to run in a more stable and reliable way, while the running wheel is able to withstand high temperature. In addition, these two components have gained China patents.
Configuration
1. Hakko touch screen is made in Japan, and it is used to real-time display working status and set heating parameters.
2. The AC contactor is manufactured by Schneider Electric in China.
3. As for running wheel bearing and pressing wheel bearing are provided by SKF.
4. All the pneumatic parts are offered by FESTO.
5. The gear motor is made by SEW.
6. There is an automatic waste cleaning device on the bottom of wafer baking oven.
7. A two-stage pressure relief valve is equipped.
8. The infrared temperature sensor used by PID controller is fabricated by Raytek.
| Model | ||||||
| Baking plate No. | 27 | 39 | 45 | 51 | 65 | 69 |
| Standard baking plate size (mm) | 470×325 | |||||
| Wafer output (sheet/hour) | 14 | 20 | 23 | 26 | 33 | 35 |
| LPG consumption in m3/h (combustion value: 117462kJ/m3) | 7 | 10 | 12 | 14 | 17 | 20 |
| LNG consumption in m3/h (combustion value: 40337kJ/m3) | 21 | 30 | 35 | 40 | 50 | 60 |
| Power (kW) | 5.52 | 5.52 | 5.52 | 5.52 | 8.12 | 8.87 |
| Overall Dimensions (without exhaust pipe) | ||||||
| Length (mm) | 6000 | 8260 | 9400 | 10550 | 13200 | 14000 |
| Width (mm) | 1700 | 1700 | 1700 | 1700 | 1750 | 1760 |
| Height (mm) | 2300 | 2300 | 2300 | 2300 | 2300 | 2300 |
| Total weight (t) | 10 | 12 | 13 | 14 | 17 | 20 |
| Compressed air consumption (m3/min) | 0.6 | 0.6 | 0.9 | 1.0 | 1.5 | 1.5 |
Note:
1. Our wafer baking oven is heated by fuel gas, and the baking plate could be as large as 500×350mm.
2. The wafer sheet measures 470×325mm, and standard pattern is 2.5×2.5×0.5mm.
3. Power consumption details:
a. Main motor: 2.2kW/380V/50Hz (SEW)
b. Draught fan for blending fuels: 2.2kW/380V/50Hz (made in China)
c. Batter feed pump: 0.75kW/380V/50Hz (SEW)
d. Cleaning device: 0.37kW/380V/50Hz (SEW)
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