The ball wafer production line, developed in the year of 2009, is intended to manufacture chocolate hazelnut ball, so it is also known as chocolate hazelnut ball production line.
In 2010, this ball wafer line conducted trial production, and it was highly appreciated by the client due to its reasonable design and high degree of automation. After that, continuous technical innovation and field inspection were implemented so as to perfect our Ferrero wafer machine, making it a quite mature wafer biscuit production line now. In addition, the nutlet sprinkling machine has obtained a Chinese invention patent, and the patent number is 201010558919.
Recommended User
Our ball wafer production line has been extensively used around the world, and it fits for large-sized factories that are dedicated to the fabrication of chocolate product or wafer biscuit, individuals who have large production workshops and sufficient funds, food practitioners that have built up complete marketing network, as well as many other investors.
Technical Advantage
The ball wafer production line is manufactured utilizing various state-of-the-art technologies, thus ensuing its overall quality.
1. Baking Plate
Thanks to the distinct casting and carving skills, our special-shaped baking plates are characterized by uniform quality and long life span.
2. Temperature Control
For the baking plates, their temperature error is not over ±3°C, and this is realized with the help of a PID controller.
3. Field Bus
The PROFIBUS DP control technology contributes to the simple machine structure and easy maintenance.
4. Third Spreading Roller
Our ball wafer production line takes advantage of a third spreading roller in order to coat a thick layer of chocolate, thus making the chocolate coating more uniform and avoiding chocolate leakage at the spreading head.
5. Nutlet Sprinkling
The fully automatic nutlet sprinkling machine is able to spread nutlets in a rapid and highly precise (98%) way.
6. Wafer Laminating
Our flip-over wafer laminating machine is designed to stack wafer sheets neatly with a very low breakage rate.
7. Wafer Trimming
This wafer biscuit production equipment makes use of a wafer trimming machine so as to offer even edges of wafer books.
8. Flat Pressing
Our wafer flat pressing machine is intended to press wafer sheets and coating layers together without damaging them.
9. Moisture Conditioning
As a result of the combination of wafer humidifying and drying (realized by cooling) treatments, chocolate and wafer biscuit are connected together in an exceptionally solid way.
10. Automatic Ball Wafer Cutting
Owing to the automatic ball wafer cutting machine, wafer balls are generated perfectly, while both wafer balls and leftover materials are automatically collected. Furthermore, the cutting dies allow fast disassembly and assembly, thus guaranteeing sanitary running, which is of great importance for the entire chocolate wafer ball production line.
Technical Data of Ball Wafer Production Line
1. 33-mould baking oven
a. Length: 6700mm
b. LNG consumption: 25m3/h
c. Power: 5.52kW
d. Production capacity: 9 pieces per minute (96 half-balls per piece)
2. Standard baking plate size: 470×325mm
3. Compressed air consumption: 0.5m3/min
4. Baking time: 3.5 minutes
5. Total length of ball wafer production line: 34,400mm
6. Rated power: 40kW
7. Min. operator number: 5
8. Floor area: All the machines take up an area of 150m2 in total, but the workshop shall be 400m2 at least.
Performance Requirement
1. At the outlet of wafer sheet picking machine, at least 98 percent of wafer sheets should have clear pattern, uniform thickness, homogeneous color and plump shape.
2. When wafer sheets are on the wafer belt conveyor, 98 percent of them shall be in good shape, and the coating weight variation should be within ±2%.
3. The ball wafer production line shall offer enough output capacity as expected. If there are 96 wafer balls in one mould, the total production capacity would reach up to as high as 23407 wafer balls every hour (96 balls/mould × 4.5 moulds/minute × 60 minutes × 0.98 × 0.97 × 0.95 = 23407 balls/h).
4. The 304N stainless steel plate is 1.2mm thick for the cooling chamber, while it is 1.5mm thick for all the other parts of this wafer biscuit line.
5. There should be sound-light alarming devices for the baking oven, chocolate spreading machine, freezer and the cutting machine.
6. If requested, the baking plates can be covered with hard chrome.
Packing
Every single machine of this ball wafer production line is packed by flat rack, and it is covered with a layer of moisture-proof film. Then, these machines are placed in two 40'HQ containers and one 40'GP container.
System Configuration
The ball wafer production line consists of 1 wafer batter mixer, 2 33-mould special-shaped wafer baking oven, 3 wafer sheet receiving machine, 4 humidifying machine, 5 wafer arranging machine, 6 special wafer cream spreader, 7 nutlet sprinkling machine, 8 wafer laminating machine, 9 wafer trimming machine, 10 wafer flat pressing machine, 11 wafer cooling machine, 12 refrigeration system, 13 inclined conveyor, 14 ball wafer cutting machine, 15 chain conveyor, 16 inclined conveyor, 17 wafer separator and 18 wafer chip smashing machine.