After processed by wafer laminating machine, wafer sheets are made into wafer books. However, these wafer books are not tidy enough around their perimeters. Under this condition, our wafer trimming machine could be applied to scrape four sides of the wafer book, thereby removing extra cream.
Aside from the abovementioned circumstance, this wafer book trimmer is also commonly utilized after wafer books are pressed by the wafer flat pressing machine because this pressing operation will squeeze out filled cream or chocolate.
In general, this hollow wafer production equipment is designed to remove filled cream or chocolate when these materials are on the side surfaces of wafer books, thus offering a tidy and aligned appearance.
Technical Data of Wafer Trimming Machine
1. Conveying motor: 0.37kW, 380V/3Ph/50Hz
2. Air consumption of up and down cylinder: 0.1m3/min/0.6MPa (FESTO or SMC)
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