Hollow Wafer Production Line: Production Flow
Batter Mixing – Batter Feeding – Baking – Humidifying – Cream Spreading – Wafer Laminating, Trimming and Pressing – Wafer Book Cooling – Cutting – Separating

1. Batter mixing: 25kg flour and 40kg water are put into the wafer batter mixer, and 65L batter is formed after 3-5 minutes of agitation.

2. Batter feeding: There is a rotor pump on the baking oven, and it helps to lay a fixed amount of batter on baking plates.

3. Baking: Our hollow wafer production line takes advantage of two baking ovens to make flat and special-shaped wafer sheets at the same time. During working, wafer batter is laid on baking plates with a fixed interval, and a PLC is employed to control baking temperature automatically.

4. Humidifying: Baked wafer sheets are delivered into the humidifying machine for the purpose of moisture conditioning.

5. Cream spreading: Cooled wafer sheets are coated with cream layers.

6. Wafer laminating, trimming and pressing: After cream spreading, wafer sheets are laminated, trimmed and pressed together by wafer laminating machine, wafer trimming machine and wafer flat pressing machine, respectively.

7. Wafer book cooling: After wafer books are produced, they are conveyed to a cooling cabinet directly so as to optimize their temperature and humidity, and this treatment is beneficial for the final taste.

8. Cutting: Hollow wafer biscuits are processed by the wafer cutting machine to get required dimensions.

9. Separating: The wafer separator is employed to separate wafer books after cutting process, and then these wafer books are transported in an ordered way.