Automatic Flat Wafer Production Line: Production Flow
Batter Mixing – Baking – Wafer Sheet Cooling – Cream Spreading – Wafer Book Cooling – Cutting

1. Batter mixing: Before production process, 25kg flour and 40kg water are poured into the wafer batter mixer to get agitated. After 3-5 minutes, corresponding wafer batter, with the volume of about 65L, is created.

2. Baking: The batter feeding unit intermittently delivers a fixed amount of wafer batter on baking plates, and then a PLC is utilized to automatically regulate the baking temperature to a desired value by heating baking plates. In this way, qualified and uniform wafer sheets are created.

3. Wafer sheet cooling: These baked wafer sheets are cooled naturally to alleviate thermal stress generated during baking process. If these wafer sheets are not cooled gently, they are very likely to get cracked even when a slight collision occurs.

4. Cream spreading: After wafer sheets are cooled down, cream is spread evenly on them. Then, cream fillings and wafer sheets are pressed slightly to get laminated. In addition, the number of cream fillings is adjustable according to practical needs.

5. Wafer book cooling: Wafer books are directly transported to the wafer cooling cabinet to receive cooling treatment, and this step is helpful in improving wafer temperature and humidity. As a result, finished wafer biscuits will be more delicious.

6. Cutting: After wafer books move out of the cooling cabinet, they are cut into desired size by a wafer cutting machine.